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Conductive connection sheet, connection between terminals, the method of forming the connection terminals, the semiconductor device and an electronic device

机译:导电连接片,端子之间的连接,形成连接端子的方法,半导体器件和电子器件

摘要

PROBLEM TO BE SOLVED: To provide a conductive connection sheet reducing the occurrence of a leak current between adjacent terminals caused by failing to coagulate a metal material in a molten state selectively on the terminals, and a connection method between the terminals using such a conductive connection sheet, a method for forming a connection terminal, a semiconductor device of high reliability, and an electronic device.;SOLUTION: The conductive connection sheet 1 includes a laminate having a resin composition layer containing a resin component, and a first metal layer 12 and a second metal layer 14 formed of metal materials with low fusing points. The fusing point of the first metal layer 12 is lower than that of the second metal layer 14.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种导电连接片,以减少由于在端子上选择性地使熔融状态的金属材料无法凝结而导致的相邻端子之间的漏电流的发生,以及使用这种导电连接的端子之间的连接方法解决方案:导电连接片1包括层压板,该层压板具有包含树脂成分的树脂组合物层,第一金属层12和第一金属层12。第二金属层14由熔点低的金属材料形成。第一金属层12的熔合点低于第二金属层14的熔合点;版权所有:(C)2011,日本特许厅

著录项

  • 公开/公告号JP5471601B2

    专利类型

  • 公开/公告日2014-04-16

    原文格式PDF

  • 申请/专利权人 住友ベークライト株式会社;

    申请/专利号JP20100045940

  • 发明设计人 中馬 敏秋;鍵本 奉広;

    申请日2010-03-02

  • 分类号H01R11/01;H01B5/16;H01L21/60;C09J7/02;C09J201/00;C09J11/06;B32B15/08;

  • 国家 JP

  • 入库时间 2022-08-21 16:13:50

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