首页> 外国专利> METHOD FOR MANUFACTURING CONDUCTIVE CONNECTION SHEET, CONNECTION METHOD BETWEEN TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

METHOD FOR MANUFACTURING CONDUCTIVE CONNECTION SHEET, CONNECTION METHOD BETWEEN TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

机译:导电连接片的制造方法,端子间的连接方法,连接端子的形成方法,半导体装置及电子设备

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive connection sheet that can manufacture the conductive connection sheet maintaining excellent adhesiveness between a metal layer and resin composition layers without causing a crack or a crease in the metal layer, and a connection method between terminals using the conductive connection sheet manufactured by such a manufacturing method, a method for forming a connection terminal, a semiconductor device of high reliability, and an electronic device.;SOLUTION: The conductive connection sheet 1 manufactured by the method for manufacturing the conductive connection sheet includes the resin composition layers 11, 13 and the metal layer 12 disposed between the resin composition layers 11, 13 and joined to them respectively. The conductive connection sheet 1 is manufactured through processes for preparing a sheet 51 having the resin composition layer 11 and the metal layer 12, and a sheet 52 having the resin composition layer 13, and pressure-fitting the sheet 51 and the sheet 52 so that the surface, opposite to the resin composition layer 11, of the metal layer 12 faces one surface of the resin composition layer 13.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种导电连接片的制造方法,该方法可以制造在金属层和树脂组合物层之间保持优异的粘合性而不会引起金属层的龟裂或折痕的导电连接片,以及提供一种导电连接片的方法。端子,其使用通过这种制造方法制造的导电连接片,用于形成连接端子的方法,高可靠性的半导体器件和电子器件。解决方案:通过用于制造导电连接的方法制造的导电连接片1该片材包括树脂组合物层11、13和分别设置在树脂组合物层11、13之间并与其接合的金属层12。导电连接片1是通过以下工序制造的:制备具有树脂组合物层11和金属层12的片材51,具有树脂组合物层13的片材52,并将该片材51和片材52压配合。金属层12的与树脂组合物层11相反的表面面对树脂组合物层13的一个表面。;版权所有:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP2011181467A

    专利类型

  • 公开/公告日2011-09-15

    原文格式PDF

  • 申请/专利权人 SUMITOMO BAKELITE CO LTD;

    申请/专利号JP20100047144

  • 发明设计人 KAGIMOTO TOMOHIRO;CHUMA TOSHIAKI;

    申请日2010-03-03

  • 分类号H01R43/02;H01L21/60;H01B13/00;H05K1/18;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 18:25:07

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