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Process for producing a resin substrate, printed wiring boards, printed circuit boards, printed wiring boards and copper-clad laminate
Process for producing a resin substrate, printed wiring boards, printed circuit boards, printed wiring boards and copper-clad laminate
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机译:树脂基板,印刷电路板,印刷电路板,印刷电路板及覆铜层压板的制造方法
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摘要
The present invention maintains the fine wire forming, and to provide a resin substrate provided with a profile shape of the surface to achieve good adhesion of the electroless copper plating film. A resin substrate surface roughness Sz of the surface is 1~5μm. [Selection Figure] Figure 3
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