Method for producing a surface sealing the silica-based particles, the surface sealing the silica-based particles and the semiconductor sealing resin composition comprising a mixture of particles

摘要

PROBLEM TO BE SOLVED: To provide a surface sealed silica particles, a method of producing thereof, and a resin composition for encapsulating a semiconductor constituted by mixing the particles.;SOLUTION: The surface sealed silica particles having moisture resistance is constituted by sealing fine pores existing on the surface of silica porous particles having an average particle size of 0.5-50 μm obtained by spray-drying a dispersion liquid containing silica fine particles having an average particle size of 2-300 nm with silica fine particles having an average particle size of 2-50 nm (including the silica fine particles whose particle surface is melted, the same hereinafter), and/or a molten matter thereof, or a dehydration condensation polymerization product of the silica fine particles and/or a molten matter thereof with silicic acid, or hydrolysis condensation polymerization product of the silica fine particles and/or a molten matter thereof with an organic silicon compound, and also provided is a method of producing thereof.;COPYRIGHT: (C)2010,JPO&INPIT