首页> 外国专利> Composition including quantum dot phosphor, quantum dot phosphor dispersed resin molded body, structure including quantum dot phosphor, light emitting device, electronic device, mechanical device, and method for producing quantum dot phosphor dispersed resin molded body

Composition including quantum dot phosphor, quantum dot phosphor dispersed resin molded body, structure including quantum dot phosphor, light emitting device, electronic device, mechanical device, and method for producing quantum dot phosphor dispersed resin molded body

机译:包括量子点磷光体的组合物,量子点磷光体分散的树脂成型体,包括量子点磷光体的结构,发光器件,电子器件,机械器件以及用于制造量子点磷光体分散的树脂成型体的方法

摘要

Composition including quantum dot phosphor capable of suppressing quenching of quantum dot phosphor, quantum dot phosphor dispersed resin molded body, structure including quantum dot phosphor, light emitting device, electronic device, mechanical device, and quantum dot phosphor dispersion A method for producing a resin molded body is provided. Disperse the quantum dot phosphor in a cycloolefin (co) polymer, which is a dispersion resin, to form a composition containing the quantum dot phosphor, and mold the composition containing the quantum dot phosphor to disperse the quantum dot phosphor. A resin molded body is used. In addition, a gas barrier layer that reduces permeation of oxygen to the quantum dot-dispersed resin molded body is formed on a part or the entire surface of the quantum dot phosphor-dispersed resin molded body. Furthermore, a light-emitting device can be constructed using the composition containing the quantum dot phosphor as a sealing material for sealing the LED chip.
机译:包括能够抑制量子点磷光体猝灭的量子点磷光体的组合物,量子点磷光体分散的树脂成型体,包括量子点磷光体的结构,发光器件,电子设备,机械设备和量子点磷光体分散体的制造树脂成型体的方法提供身体。将量子点荧光粉分散在作为分散树脂的环烯烃(共)聚合物中,以形成包含量子点荧光粉的组合物,并且模制包含量子点荧光粉的组合物以分散量子点荧光粉。使用树脂成型体。另外,在该量子点荧光体分散树脂成型体的一部分或整个表面上形成有减少氧向该量子点分散树脂成型体的渗透的阻气层。此外,可以使用含有量子点荧光体的组合物作为密封LED芯片的密封材料来构成发光装置。

著录项

  • 公开/公告号JPWO2012102107A1

    专利类型

  • 公开/公告日2014-06-30

    原文格式PDF

  • 申请/专利权人 昭和電工株式会社;

    申请/专利号JP20120554726

  • 发明设计人 内田 博;安田 剛規;藤田 俊雄;

    申请日2012-01-16

  • 分类号C09K11/02;C09K11/08;H01L33/50;H01L33/56;C08L45;C08K3/08;C08J7/04;

  • 国家 JP

  • 入库时间 2022-08-21 16:11:51

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