Resin attaching lead/read frame and its production manner, and lead/read frame

摘要

Resin attaching lead/read frame 10, the multiple die/di pads (the LED component mount section) alienating from 25 and each die/di pad 25, as it possesses with the multiple lead/read sections 26 which are laid out, each die/di pad has the lead/read frame itself 11 where the LED component mount field 14 was formed to the surface of 25 and each lead/read section 26. In order to surround each LED component mount field 14 of lead/read frame itself 11, reflected resin section 23 is provided. On each LED component mount field 14 surfaces of lead/read frame itself 11, aluminum evaporation formation or aluminum spatter formation 12 is provided.