The tablet, and the electronic device device which for electronic device seal can the brush revetment inorganic powder constituent for electronic device seal making use of and that

摘要

PPROBLEM TO BE SOLVED: To provide a resin-coated inorganic powder composition for sealing electronic elements that exhibits excellent adhesion to electronic elements and can realize a thin structure, a tablet obtained using the same, and an electronic element device using these. PSOLUTION: The resin-coated inorganic powder composition for sealing electronic elements comprises an aggregate composed of an inorganic powder coated with a resin layer comprising the following components (A) and (B), where the content ratio of the inorganic powder is set to 80-95 wt.% based on the whole composition. (A) An aminomethylol group-containing polycondensate obtained by causing a compound bearing at least two amino groups in one molecule to react with formaldehyde in a molar ratio of 1.5-2.5. (B) A thermosetting resin. PCOPYRIGHT: (C)2008,JPO&INPIT