Sho forming the street of eye

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer avoiding the mixing of air bubbles between an adhesive sheet and a wafer when the adhesive sheet for protection is stuck to the wafer, and to provide a manufacturing method of the wafer.;SOLUTION: A plurality of circuit patterns 10 are formed on a surface of the semiconductor wafer W. Streets 11 are formed between the circuit patterns 10 in vertical and lateral directions so that they show a latticed pattern. Through holes 12 penetrating the wafer W are formed in the respective streets 11 so that they are dispersed along the streets 11 with a prescribed interval therebetween. The adhesive sheet S for protection is stuck to a circuit pattern 10-side and processing such as backside grinding and dicing is performed on the wafer W.;COPYRIGHT: (C)2009,JPO&INPIT