Peelable pressure-sensitive adhesive, peelable pressure-sensitive adhesive sheet, peeling method of peelable pressure-sensitive adhesive sheet

摘要

PPROBLEM TO BE SOLVED: To provide an adhesive sheet for temporarily protecting the surface of a metal plate, a glass plate, a plastic plate and the like and an adhesive sheet for processing electronic components, and more precisely, a peelable adhesive agent used for the adhesive sheet for fixing a semiconductor in a dicing step or a back-grinding step of a semiconductor wafer, a semiconductor substrate and the like. PSOLUTION: The peelable adhesive agent is obtained by crosslinking an active energy-curable resin composition [I] comprising a polyester resin (A) and an unsaturated group-containing compound (B) with a crosslinking agent (C). PCOPYRIGHT: (C)2010,JPO&INPIT