The electronic part null which formed the electrodeposition membrane with electric copper plating bath and particular

摘要

PROBLEM TO BE SOLVED: To successfully achieve both copper filling in a via hole and uniform electrodeposition properties in a through hole in an electrolytic copper plating bath.;SOLUTION: A tin or tin alloy plating bath is provided, which contains (A) a soluble copper salt, (B) an acid or the salt thereof, and (C) a specific phenanthrolinedione compound. Both copper filling in a via hole and uniform electrodeposition properties in a through hole are successfully achieved by containing the phenanthrolinedione compound, and productivity is improved by applying the electrolytic copper plating bath to a substrate in which the via hole and the through hole exist together.;COPYRIGHT: (C)2013,JPO&INPIT