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Temperature-raising device and heated test method

机译:升温装置及加热试验方法

摘要

PROBLEM TO BE SOLVED: To provide a temperature elevation apparatus which is reduced in size and low-priced, facilitates temperature control and in addition, can be applied to a temperature elevation test at a high temperature exceeding a temperature limit of a semiconductor device comprised of silicon; and a temperature elevation test method employing the temperature elevation apparatus.;SOLUTION: A power supply voltage is applied from an external DC power source 2 to a drain electrode of an MOSFET 10 comprised of silicon carbide (SiC), and a variable bias voltage generated from the applied power supply voltage is applied to a gate electrode 13, thereby elevating a temperature of the MOSFET 10. A change in a voltage obtained by dividing the power supply voltage through resistors R1, R2 is amplified with a predetermined negative amplification factor by an MOSFET 20 and added to a voltage, obtained by dividing the power supply voltage through resistors R3, R4, by a drain electrode 21, so that a voltage of the drain electrode 21 is fixed and the bias voltage is kept constant.;COPYRIGHT: (C)2012,JPO&INPIT
机译:要解决的问题:提供一种尺寸减小且价格低廉,便于温度控制的温度升高装置,此外,还可以将其应用于在超过由以下组成的半导体器件的温度极限的高温下进行温度升高测试硅;解决方案:从外部直流电源2向由碳化硅(SiC)构成的MOSFET 10的漏极施加电源电压,并产生可变的偏置电压。来自施加的电源电压的电压被施加到栅电极13,从而升高MOSFET 10的温度。通过电阻器R1,R2对电源电压进行分压而获得的电压的变化以预定的负放大率被放大。 MOSFET 20并通过漏电极21加到通过电阻R3,R4对电源电压进行分压而获得的电压上,从而使漏电极21的电压固定并且偏置电压保持恒定。 C)2012,日本特许厅

著录项

  • 公开/公告号JP5434844B2

    专利类型

  • 公开/公告日2014-03-05

    原文格式PDF

  • 申请/专利权人 住友電気工業株式会社;

    申请/专利号JP20100175456

  • 发明设计人 澤田 研一;

    申请日2010-08-04

  • 分类号G01R31/26;

  • 国家 JP

  • 入库时间 2022-08-21 16:10:57

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