Electronic device formed by using the same and method of manufacturing electronic devices, electrical formed by using the same manufacturing method and the electrical and electronic parts, electronic parts

摘要

Was carried backside processing of a semiconductor wafer in a state of being supported by the supporting substrate first through the fixed resin layer first functional surface of the semiconductor wafer, then through the fixing resin layer of the second back surface of the semiconductor wafer By mounting the semiconductor device in a state of being supported by a supporting substrate having a second Te, it is possible to manufacture the WL-CSP-type electronic device having a COW structure.