TRAY FOR ALIGNING SEMICONDUCTOR PACKAGES AND TEST HANDLER USING THE SAME, AND METHOD OF ALIGNING SEMICONDUCTOR PACKAGES AND TEST METHOD USING THE SAME

摘要

Disclosed are a tray for aligning semiconductor packages, a test handler using the same, and a method of aligning the semiconductor packages, and a test method using the same. According to the present inventive concept, the tray for aligning the semiconductor packages includes a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. The semiconductor package is aligned at the package pocket portion.