首页> 外国专利> PRESSURE-CONTROLLED WAFER CARRIER AND WAFER TRANSPORT SYSTEM

PRESSURE-CONTROLLED WAFER CARRIER AND WAFER TRANSPORT SYSTEM

机译:压控晶圆载体和晶圆运输系统

摘要

Disclosed are a wafer carrier that keeps wafers under a constant pressure, at any preset value below or above the atmospheric pressure, to prevent wafer contaminations arising from atmospheric exposure in conventional wafer carriers, and also, a wafer transport system and method utilizing the same wafer carrier. The wafer carrier charged with a preset carrier pressure is transported and docked with an airlock of a wafer processing tool comprising the airlock, a vacuum transfer module, and a process chamber. The airlock adjusts, by a gas pump, inner pressure to equate successively with, first, the carrier pressure before opening the carrier door, and next, the vacuum transfer module pressure before opening the latter's door. The wafers are then transferred into the process chamber. After processing, the wafers are transferred back into the wafer carrier and charged with the preset carrier pressure before undocked and transported to the next wafer processing tool.
机译:公开了一种晶片载体,该晶片载体将晶片保持在恒定压力下,该压力处于低于或高于大气压的任何预设值,以防止常规晶片载体中由于大气暴露而引起的晶片污染,并且还公开了利用该晶片的晶片输送系统和方法载体。载有预设载气压力的晶片载具被运输并与晶片处理工具的气锁对接,该晶片处理工具包括气锁,真空传输模块和处理室。气闸通过气泵调节内部压力,以使其先后等于打开承运人门之前的承运人压力,其次等于打开承运人门之前的真空传递模块压力。然后将晶片转移到处理室中。在处理之后,晶片被移回到晶片载体中,并在预设的载体压力下被加载,然后再移开并输送到下一个晶片处理工具。

著录项

  • 公开/公告号US2014271053A1

    专利类型

  • 公开/公告日2014-09-18

    原文格式PDF

  • 申请/专利权人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.;

    申请/专利号US201313831498

  • 发明设计人 SHIH-HUNG CHEN;

    申请日2013-03-14

  • 分类号H01L21/673;

  • 国家 US

  • 入库时间 2022-08-21 16:10:15

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