首页> 外国专利> SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE FOR DECREASING EQUIVALENT SERIES RESISTANCE AND METHOD OF MANUFACTURING THE SAME

SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE FOR DECREASING EQUIVALENT SERIES RESISTANCE AND METHOD OF MANUFACTURING THE SAME

机译:减小等效串联电阻的固体电解电容器包装结构及其制造方法

摘要

A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion.
机译:用于减小等效串联电阻(ESR)的固体电解电容器封装结构,包括电容器单元,封装单元和导电单元。电容器单元包括顺序地彼此堆叠并彼此电连接的多个第一堆叠型电容器。封装单元包括用于包围电容器单元的封装体。导电单元包括具有通孔的第一导电端子和第二导电端子,并且堆叠型电容器电连接在第一导电端子和第二导电端子之间。最底部的第一堆叠型电容器通过导电膏位于第二导电端子的顶表面上,该导电膏具有设置在最底部的第一堆叠型电容器和第二导电端子的顶表面之间的第一导电部分以及第二导电部分填充通孔以与第一导电部分连接。

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