首页> 外国专利> POLYVINYLIDENE FLUORIDE RESIN EXPANDED BEADS, METHOD FOR PRODUCING POLYVINYLIDENE FLUORIDE RESIN EXPANDED BEADS, AND MOLDED ARTICLES OF POLYVINYLIDENE FLUORIDE RESIN EXPANDED BEADS

POLYVINYLIDENE FLUORIDE RESIN EXPANDED BEADS, METHOD FOR PRODUCING POLYVINYLIDENE FLUORIDE RESIN EXPANDED BEADS, AND MOLDED ARTICLES OF POLYVINYLIDENE FLUORIDE RESIN EXPANDED BEADS

机译:聚偏二氟乙烯树脂发泡板,聚偏二氟乙烯树脂发泡板的生产方法以及聚偏二氟乙烯树脂发泡板的模制品

摘要

There is provided polyvinylidene fluoride resin expanded beads which have a high expansion ratio, do not shrink easily, and are capable of obtaining a molded article of the expanded beads that is excellent in mold reproducibility and dimensional stability. The polyvinylidene fluoride resin expanded beads include a polyvinylidene fluoride resin as a base resin, in which a flexural modulus of the polyvinylidene fluoride resin is 450 MPa or more, a melt flow rate (MFR) of the polyvinylidene fluoride resin is 1 g/10 min or more at 230° C. and 2.16 kg load, an apparent density of the expanded beads is 25 to 150 g/L, and a closed cell content of the expanded beads is 80% or more.
机译:本发明提供具有高发泡倍率,不易收缩,并且能够得到成型再现性和尺寸稳定性优异的发泡珠粒的成型品的聚偏二氟乙烯系树脂发泡珠粒。聚偏二氟乙烯树脂发泡珠包括聚偏二氟乙烯树脂作为基础树脂,其中聚偏二氟乙烯树脂的弯曲模量为450 MPa或更高,聚偏二氟乙烯树脂的熔体流动速率(MFR)为1 g / 10 min当在230℃和2.16kg的载荷下为大于或等于300℃时,膨胀珠粒的表观密度为25至150g / L,并且膨胀珠粒的闭孔含量为80%以上。

著录项

  • 公开/公告号US2014171524A1

    专利类型

  • 公开/公告日2014-06-19

    原文格式PDF

  • 申请/专利权人 JSP CORPORATION;

    申请/专利号US201314105685

  • 发明设计人 MASAHARU OIKAWA;MITSURU SHINOHARA;

    申请日2013-12-13

  • 分类号C08F14/22;C08J9/18;

  • 国家 US

  • 入库时间 2022-08-21 16:09:05

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