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METHODS OF FORMING A BARRIER SYSTEM CONTAINING AN ALLOY OF METALS INTRODUCED INTO THE BARRIER SYSTEM, AND AN INTEGRATED CIRCUIT PRODUCT CONTAINING SUCH A BARRIER SYSTEM
METHODS OF FORMING A BARRIER SYSTEM CONTAINING AN ALLOY OF METALS INTRODUCED INTO THE BARRIER SYSTEM, AND AN INTEGRATED CIRCUIT PRODUCT CONTAINING SUCH A BARRIER SYSTEM
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机译:形成包含引入到屏障系统中的金属合金的屏障系统的方法,以及包含这种屏障系统的集成电路产品
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摘要
One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a barrier system comprised of at least one barrier material and at least two metallic elements, and performing a heating process to form a metal alloy comprised of the at least two metallic elements in the barrier system. Also disclosed is a device that comprises a trench/via in a layer of insulating material, a barrier system positioned in the trench/via, wherein the barrier system comprises at least one barrier material and a metal alloy comprised of at least two metallic elements that are comprised of materials other than the at least one barrier material, and a conductive structure positioned in the trench/via above the barrier system.
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