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Au—Sn alloy bump including no large void and method of producing same
Au—Sn alloy bump including no large void and method of producing same
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机译:不含大空隙的Au-Sn合金凸块及其制造方法
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摘要
An Au—Sn alloy bump that does not include large voids and a method of producing the same are provided. The Au—Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix.
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