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In Situ Heating Transmission Electron Microscopy Observation of Nanoeutectic Lamellar Structure in Sn–Ag–Cu Alloy on Au Under-Bump Metallization

机译：在Sn-Ag-Cu合金中对氮-Ag-Cu合金纳米晶体层状结构的原位加热透射电子显微镜观察Au

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Jong-Hyun Seo; Sang-Won Yoon; Kyou-Hyun Kim; Hye-Jung Chang; Kon-Bae Lee; Tae-Yeon Seong; Eric Fleury; Jae-Pyoung Ahn;
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机译：Mg-Al-Zn-Sn合金中析出物和γ-Mg_{17 Al _{12 与镁基基体之间的析出和新取向关系的原位透射电镜观察}}
2. In situ transmission electron microscopy observations of precipitation and a new orientation relationship between γ-Mg_(17)Al_(12) and magnesium-based matrix in an Mg-Al-Zn-Sn alloy [J] . Yu Liu, Dongshan Zhao, Xin Nie Philosophical Magazine Letters . 2012,第10a12期

机译：Mg-Al-Zn-Sn合金中的析出及γ-Mg_（17）Al_（12）与镁基基体之间新的取向关系的原位透射电镜观察
3. In Situ Scanning Electron Microscopy Observation of Tensile Deformation in Sn-Ag-Cu Alloys Containing Rare-Earth Elements [J] . WEI MIN XIAO, YAO WU SHI, YONG PING LEI, Journal of Electronic Materials . 2008,第11期

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4. Characterizing metallurgical reaction of Sn–Pb solder with Ni/Cu under-bump metallization by electron microscopy [C] . Li-Yin Hsiao Jenq-Gong Duh* International Conference on Metallurgical Coatings and Thin Films . 2006

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5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

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6. In-Situ High-Resolution Transmission Electron Microscopy Investigation of Overheating of Cu Nanoparticles [O] . Chunlin Chen, Ziyu Hu, Yanfen Li, -1

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7. Equilibrium Cu-Ag nanoalloy structure formation revealed by in situ scanning transmission electron microscopy heating experiments [O] . Ping Lu, Michael Chandross, Timothy J. Boyle, 2014

机译：通过原位扫描透射电子显微镜加热实验揭示了平衡Cu-ag纳米合金结构的形成

In Situ Heating Transmission Electron Microscopy Observation of Nanoeutectic Lamellar Structure in Sn–Ag–Cu Alloy on Au Under-Bump Metallization

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