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Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
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机译:集成电路封装,包括直接连接垫,盲孔和电耦合至直接连接垫的接合垫
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摘要
An integrated circuit package including a semiconductor die and a flexible circuit (flex circuit), and a method for forming the integrated circuit package. The flex circuit can include a direct connect pad which is not electrically coupled to an active trace, a blind via electrically coupled to the direct connect pad, and a semiconductor die having a bond pad which is electrically coupled to the direct connect pad using a conductor. The bond pad, the conductor, the direct connect pad, and the blind via can all be vertically aligned, each with the other.
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