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TEST DEVICE, TEST SYSTEM, METHOD AND CARRIER FOR TESTING ELECTRONIC COMPONENTS UNDER VARIABLE PRESSURE CONDITIONS
TEST DEVICE, TEST SYSTEM, METHOD AND CARRIER FOR TESTING ELECTRONIC COMPONENTS UNDER VARIABLE PRESSURE CONDITIONS
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机译:在可变压力条件下测试电子组件的测试装置,测试系统,方法和载体
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26Test device, test system, method and carrier for testing electronic components under variable pressure conditions5 AbstractA test device, a test system, a method and a carrier for testing electronic components under variable pressure conditions comprise: a first chamber half and a second chamber half, a first gasket and a second gasket, a carrier10 segment adapted to carry a plurality of electronic components, and a circularcarrier section surrounding the carrier segment. The circular carrier section comprises a first side and a second side. The first gasket is placed between the first chamber half and the first side of the circular carrier section to form an airtight seal and the second gasket is placed between the second chamber half15 and the second side of the circular carrier section to form an airtight seal.(Fig. 2)
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