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Test device, test system, method and carrier for testing electronic components under variable pressure conditions
Test device, test system, method and carrier for testing electronic components under variable pressure conditions
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机译:用于在可变压力条件下测试电子元件的测试装置,测试系统,方法和载体
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摘要
A test device (300), a test system (100), a method and a carrier (190) for testing electronic components (191,192,193,194,195,196) under variable pressure conditions comprise: a first chamber half (313) and a second chamber half (318), a first gasket (311) and a second gasket (316), a carrier segment (611)adapted to carry a plurality of electronic components, and a circular carrier section (711) surrounding the carrier segment (611). The circular carrier section (711) comprises a first side (713) and a second side (718). The first gasket (311) is placed between the first chamber half (313) and the first side (713) of the circular carrier section (711) to form an airtight seal and the second gasket (316) is placed between the second chamber half (318) and the second side (718) of the circular carrier section (711) to form an airtight seal.
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