首页> 外国专利> MULTIPLE CAVITY ETCHED-FACET DFB LASERS

MULTIPLE CAVITY ETCHED-FACET DFB LASERS

机译:多腔刻面DFB激光

摘要

A semiconductor chip has at least two DFB etched facet laser cavities with one set of facets with AR coatings and a second set of etched facets with HR coatings that have a different relative position with respect to the gratings. This creates a difference in the phase between each of the etched facets and the gratings which changes the operational characteristics of the two laser cavities such that at least one of the lasers provides acceptable performance. As a result, the two cavity arrangement greatly improves the yield of the fabricated chips.
机译:半导体芯片具有至少两个DFB蚀刻的刻面激光腔,这些腔具有一组具有AR涂层的刻面和第二组具有HR涂层的刻面,它们相对于光栅具有不同的相对位置。这在每个蚀刻的小平面和光栅之间产生了相位差,该相位差改变了两个激光腔的工作特性,从而至少一个激光器提供了可接受的性能。结果,两个腔的布置大大提高了所制造芯片的成品率。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号