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TREATMENT OF PREFORMS CONTAINING COPPER WITH A MIXTURE CONTAINING CHLORINE-FREE AND CARBOXYL-FREE ACIDS AND OXIDANTS
TREATMENT OF PREFORMS CONTAINING COPPER WITH A MIXTURE CONTAINING CHLORINE-FREE AND CARBOXYL-FREE ACIDS AND OXIDANTS
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机译:含无氯无羧酸和氧化剂的混合物处理含铜预成型坯
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摘要
A method for treating preforms containing copper, wherein an aqueous mixture (M), containing (a.) chlorine-free acids without carboxyl groups, (b.) oxidants, (c.) aqueous solvent and optionally further additives is brought into contact with the preform. The method is inter alia characterized in that the aqueous mixture (M) additionally (e.) contains dissolved copper after etching or pickling and is separated from the preform. The invention also relates to a method for processing the separated aqueous mixture (M), which additionally contains dissolved copper, by electrolysis. The invention further relates to mixtures (MI) containing (a.) from 10 to 40% w/w methane sulphonic acid, (b.) from 10 to 20% w/w hydrogen peroxide and (c.) from 40 to 80% w/w water and to the use thereof for etching or pickling preforms containing copper.
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机译:一种处理含铜预成型坯的方法,其中使包含(a。)不具有羧基的无氯酸,(b。)氧化剂,(c。)水性溶剂和任选的其他添加剂的水性混合物(M)与瓶坯。该方法的特征尤其在于,水性混合物(M)另外(e。)在蚀刻或酸洗之后还包含溶解的铜,并与预成型件分离。本发明还涉及通过电解处理分离的含水混合物(M)的方法,所述含水混合物还包含溶解的铜。本发明进一步涉及包含(a。)10至40%w / w的甲磺酸,(b。)10至20%w / w的过氧化氢和(c。)40至80%的混合物(MI)。 w / w水及其在蚀刻或酸洗含铜预成型坯中的用途。
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