A crimping apparatus includes a ram having crimp tooling for crimping a terminal to a wire during a crimp stroke and a force sensor detecting a crimp force during the crimp stroke. The crimping apparatus also includes a controller that monitors the crimp quality of a crimp based on a frequency profile of the crimp. Also provided is a method of monitoring crimp quality comprising measuring crimp forces during a crimp stroke (102); creating a force profile (104); converting the crimp forces to a frequency profile using a frequency transform algorithm (106); and analyzing the frequency profile to determine a crimp quality (108).
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