Method for producing three-dimensional metal micro-parts by growth in a mixed cavity and micro-parts obtained by the method

摘要

The method comprises: assembling a conductive or insulating plate (2) comprising a set of cavities (3) on a conductive support (1); depositing a photoresist layer (6) on the plate, polymerizing and irradiating through a photomask (5) using each cavity, and removing the uncured photoresist layer to obtain a set of joint cavities comprising a first level formed by the cavities of the plate and a second level formed in the photoresist layer positioned on the first level; and depositing metal layers by electroforming in each joint cavity to fill the first and second levels. The method comprises: assembling a conductive or insulating plate (2) comprising a set of cavities (3) on a conductive support (1); depositing a photoresist layer (6) on the plate, polymerizing and irradiating through a photomask (5) using each cavity, and removing the uncured photoresist layer to obtain a set of joint cavities comprising a first level formed by the cavities of the plate and a second level formed in the photoresist layer positioned on the first level, where an area of the photoresist layer is located in the vicinity of each cavity; depositing metal layers by electroforming in each joint cavity to fill the first and second levels; mechanical machining the metal layers to a predetermined thickness and removing the cured photoresist layer; and removing the metal layers of each cavity of the plate and the conductive support to obtain a set of metal micro-parts. The cavities of the plate have internal walls comprising oblique flank structure, vertical bearings or vertical, horizontal or oblique combination bearings. A deposition of a conductive layer is performed on the surface of the plate before the deposition of the photoresist layer when a ratio between the thickness of the photoresist layer and the width of the bearing forming a bottom of the cavities formed in the photoresist layer is = 1. An insulating layer affords vertical growth of the metal layers during the electroforming by penetrating into a structure of the inner walls of the cavities. The deposition of the conductor layer is performed on the photoresist layer after obtaining the joint cavities in the photoresist layer. The conductive layer forms a base traversing the plate. The method further comprises additionally machining the metal layers before the removal of the cured photoresist and the conductive support, and machining cavities in the conductive support prior to a step of depositing the insulating layer on inner walls of the cavities of the plate. The machining is performed by traversing the obtained levels by photolithography in the photoresist layer. The levels are arranged so that the metal layers grow in the levels having a contour perimeter that increases with an overall thickness of the metal layers. The obtained metal micro-parts comprise a number of parts corresponding to the number of levels of joint cavities. An independent claim is included for a micro mechanical-part.