TFT SUBSTRATE AND PRODUCTION METHOD THEREFOR, AND TRANSPARENT CONDUCTIVE FILM LAMINATE SUBSTRATE PROVIDED WITH Al WIRING AND PRODUCTION METHOD THEREFOR, AND TRANSPARENT CONDUCTIVE FILM LAMINATE CIRCUIT BOARD PROVIDED WITH Al WIRING AND PRODUCTION METHOD THEREFOR, AND OXIDE TRANSPARENT CONDUCTIVE FILM MATERIAL

摘要

By using a transparent conductive material containing a specific metal in the transparent conductive film, a laminated structure of the Al wiring installation . The simplified method of manufacturing the circuit board ; transparent substrate (1), Al wiring made of the transparent substrate (1) provided on a wiring, Al or Al alloy (7), and indium- zinc-oxide as a main component made of a conductive tin oxide, constitute a transparent conductive film laminated circuit substrate having an Al wiring which is characterized in that it comprises a transparent conductive film 9 to be bonded directly to the Al wiring. Without providing a barrier between the metal, since the direct Al wiring 7 and the transparent conductive film 9 is directly bonded, the manufacturing process can be simplified. Further, because using the conductive oxide of a specific composition, even if the direct bonding with Al wiring contact resistance can be suppressed to a small value.