首页> 外国专利> CROSS-LINKED POLYIMIDE RESIN AND METHOD FOR PRODUCING SAME, ADHESIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF, COVER LAY FILM, CIRCUIT BOARD, HEAT-CONDUCTIVE SUBSTRATE, AND HEAT-CONDUCTIVE POLYIMIDE FILM

CROSS-LINKED POLYIMIDE RESIN AND METHOD FOR PRODUCING SAME, ADHESIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF, COVER LAY FILM, CIRCUIT BOARD, HEAT-CONDUCTIVE SUBSTRATE, AND HEAT-CONDUCTIVE POLYIMIDE FILM

机译:交联聚酰亚胺树脂及其制备方法,粘合剂组合物及其固化产品,覆盖膜,电路板,导热基材和导热聚酰亚胺膜

摘要

Disclosed is a cross-linked polyimide resin produced by reacting (A) a polyimide siloxane having a ketone group with (B) an amino compound having at least two primary amino groups as functional groups. Each of the amino groups in the amino compound, i.e., the component (B), is reacted with at least a part of the ketone group in the polyimide siloxane, i.e., the component (A), to form a C=N bond. Thus, the cross-linked polyimide resin has such a structure that the polyimide siloxane is crosslinked through the amino compound. When a hydrogen-bond-forming group is contained in the component (A), the formation of the C=N bond can be promoted.
机译:公开了一种交联聚酰亚胺树脂,其通过使(A)具有酮基的聚酰亚胺硅氧烷与(B)具有至少两个伯氨基作为官能团的氨基化合物反应而制备。氨基化合物中的每个氨基,即组分(B),与聚酰亚胺硅氧烷中的至少一部分酮基即组分(A)反应,形成C = N键。因此,交联的聚酰亚胺树脂具有通过氨基化合物使聚酰亚胺硅氧烷交联的结构。当组分(A)中包含形成氢键的基团时,可以促进C = N键的形成。

著录项

  • 公开/公告号KR20140021001A

    专利类型

  • 公开/公告日2014-02-19

    原文格式PDF

  • 申请/专利权人 NIPPON STEEL & SUMIKIN CHEMICAL CO. LTD.;

    申请/专利号KR20137029319

  • 发明设计人 SUTO YOSHIKI;MORI AKIRA;WANG HONGYUAN;

    申请日2012-05-30

  • 分类号C08G73/10;C08L79/08;C08L83/10;C09J7/02;C09J11/04;C09J179/08;B32B27/00;B32B27/34;H05K3/28;

  • 国家 KR

  • 入库时间 2022-08-21 15:43:37

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