PHOTOSENSITIZATION EPOXY RESIN COMPOSITIONS FOR FORMING VIA HOLE, AND METHOD FOR FORMING VIA HOLE ON PCB USING THE SAME

摘要

The present invention relates to a photosensitive epoxy resin composition for forming a via hole which comprises a photoacid generator and an epoxy resin and a method of forming a via hole of a printed circuit board using the same. The present invention is able to form a via hole through a light exposure and develop process by using the photosensitive epoxy resin composition using piperidinium salt as the photoacid generator. The method for forming the via hole using the photosensitive epoxy resin composition for forming the via hole according to the present invention simplifies a process as compared to an existing technology and is able to reduce costs. Additionally, the method for forming the via hole according to the present invention is able to solve problems lowering the intrinsic properties of epoxy during an epoxy resin denaturation process of existing technology. The present invention is able to provide the photosensitive epoxy resin composition for forming the via hole to a part requiring the intrinsic property maintenance of the epoxy resin such as heat resistance, adhesion, chemical resistance, toughness, electric insulation and the like. [Reference numerals] (AA) Direct coating method; (BB,PP) Epoxy resin composition; (CC,RR) Base (PCB substrate); (DD,SS) Ultraviolet rays; (EE,TT) Pattern mask; (FF,UU) Developer; (GG) Ultrasonic developing method; (HH) Coating; (II,MM) Drying; (JJ) Transferring; (KK) Exposing; (LL) Developing; (NN) Post-hardening; (OO) Film transferring method; (QQ) Film; (VV) Spraying method