PHENOLIC RESIN WITH LOW DIELECTRIC PROPERTIES, EPOXY RESIN WITH LOW DIELECTRIC PROPERTIES AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a phenol resin with low dielectric properties, an epoxy resin with low dielectric properties and a manufacturing method thereof and, more specifically, to a phenol resin with low dielectric properties and an epoxy resin with low dielectric properties capable of uniformly realizing low dielectric properties while satisfying physical properties required for a sealing material, a molding material, a casting material, a binding material, a material for an electrical insulation paint and the like used in an electronic part or a copper clad laminate used in a printed circuit board, and to a manufacturing method thereof.;COPYRIGHT KIPO 2014