Fast Curable Epoxy Adhesive Composition at Low Temperature and Encapsulation Method of Organic Electronic Device Using the Same

摘要

PURPOSE: A low temperature-curable epoxy resin adhesive composition is provided to minimize curling failure of an organic electronic device, by reducing thermal stress due to difference of thermal expansion coefficients between layers, at hardening. CONSTITUTION: A low temperature-curable epoxy resin adhesive composition is used for sealing or capsulating, comprises an epoxy resin with a moisture permeability of 20 g/m^2day, and a latent curing agent. The adhesive composition has a curing degree of 90% or more within 3 hours at 70 C or less and stability at room temperature is 3 days or more. A sealing method of an organic electronic device comprises a step of applying an adhesive layer(22) to cover the whole side of the organic electronic device; and a step of curing the adhesive layer.