Composition for encapsulation material of photoelectronic device, encapsulation material made from the composition and light emitting diode comprising the encapsulation material

摘要

epoxy resin in accordance with an aspect of the present invention and the polysilazane to the epoxy resin and the curing reaction sealed damper of the opto-electronic device comprising a composition is provided. According to another aspect of the present invention, a silicone resin composition and a sealing damper of the opto-electronic device comprising the polysilazane to the silicone resin and the curing reaction is provided . ;