首页> 外国专利> MAKING METHOD OF METAL CORE PCB BY HOLE PUNCHING AND METAL CORE PCB THEREBY

MAKING METHOD OF METAL CORE PCB BY HOLE PUNCHING AND METAL CORE PCB THEREBY

机译:冲孔金属芯PCB的制作方法及其金属芯PCB的制作方法

摘要

The present invention relates to a method of manufacturing a metal core PCB by hole punching and a metal core PCB thereof. The method of manufacturing the metal core PCB, in which a core layer is formed by inserting the metal core into a resin layer of the PCB including a resin layer and a metallic thin film formed at a surface thereof, includes forming a guide hole at an edge of the metallic plate; forming a plurality of non-contact holes at an inner part of the metallic plate having a guide hole through a pouching work; removing bur formed at the edge of the non-contact hole of the metallic plate through the punching work; preparing a metallic ore source plate having the metallic plate serving as a metallic core layer in the resin layer by laminating the metallic plate having a plurality of the non-contact holes without the bur and the inner resin layer and the surficial metallic thin film; and forming a contact hole and a non-contact hole in matching with the non-contact hole of the metallic core source plate having the core layer, thereby improving the production rate of the PCB and the productivity of the PCB to reduce the failure rate.
机译:本发明涉及一种通过打孔制造金属芯PCB的方法及其金属芯PCB。制造金属芯PCB的方法,其中通过将金属芯插入包括树脂层和形成在其表面上的金属薄膜的PCB的树脂层中而形成芯层,该方法包括在金属芯PCB上形成引导孔。金属板的边缘;通过装袋加工在具有导向孔的金属板的内部形成多个非接触孔;通过冲压加工去除形成在金属板的非接触孔的边缘处的毛刺;通过层压具有多个没有bur和内部树脂层以及表面金属薄膜的非接触孔的金属板,制备在树脂层中具有金属板作为金属芯层的金属矿源板;通过与具有芯层的金属芯源板的非接触孔配合形成接触孔和非接触孔,从而提高了PCB的生产率和PCB的生产率,从而降低了故障率。

著录项

  • 公开/公告号KR101391938B1

    专利类型

  • 公开/公告日2014-05-12

    原文格式PDF

  • 申请/专利权人 SEIL ELECTRONICS CO. LTD.;

    申请/专利号KR20120133747

  • 发明设计人 AHN JAE HWA;YOUN SANG SEOP;

    申请日2012-11-23

  • 分类号H05K3/40;B26F1/02;B26F1/16;

  • 国家 KR

  • 入库时间 2022-08-21 15:41:01

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