SLURRY COMPOSITION AND METHOD FOR POLISHING SUBSTRATE OR WAFER USING SAME

摘要

The present invention relates to a slurry composition and a method for polishing a substrate or a wafer using the same. The slurry composition of the present invention is dispersed to have positive charges, has high polishing speeds at a high step area, and forms a polishing protective film at a low step area to suppress polishing. Moreover, the composition prevents the aggregation of polishing particles by maintaining high dispersion stability and includes polishing particles manufactured through a liquid phase method, thereby reducing microscratches and defects.;COPYRIGHT KIPO 2014