首页> 外国专利> Sintered AZO formation adding Calcium, sputtering target comprised of the formation, substrate with Calcium containing conduction layer, and method for depositing the layer

Sintered AZO formation adding Calcium, sputtering target comprised of the formation, substrate with Calcium containing conduction layer, and method for depositing the layer

机译:添加钙的烧结AlZO地层,由该地层构成的溅射靶,具有含钙导电层的基板以及该层的沉积方法

摘要

The present invention relates to a calcium-added sintered AZO capable of improving layer formation speed by preventing the generation of particles degrading the layer properties of a conductive layer while reducing the resistivity value of the conductive layer which is formed on the surface of a substrate, a sputtering target, a substrate with calcium-added conductive layer and a method for forming a layer. The method for forming a layer which forms a layer on the surface of a substrate by using a direct current magnetron sputtering device comprises: a step of arranging the substrate and calcium-added ZAO target in a chamber by using a substrate holder and a target holder of the direct current magnetron sputtering device; a step of exhausting the chamber until the internal pressure of the chamber reaches the degree of a vacuum by operating a vacuum pump connected to the exhaust pipe of the chamber; a step of supplying argon gas as sputtering gas to the chamber and supplying hydrogen gas as reaction stimulation gas to the chamber; and a step of performing sputtering by applying voltage to the substrate connected to the positive electrode of a direct-current power, and the calcium-added AZO target connected to the negative electrode and causing plasma discharge. The hydrogen gas volume supplied to the chamber is controlled according to the content of calcium contained in the calcium-added AZO target. [Reference numerals] (AA) Resistivity (ohm Cm);(BB) Comparative example;(CC) Example;(DD) Partial ratio of H_2
机译:本发明涉及一种加钙的烧结AZO,其能够通过减少颗粒的产生来提高层形成速度,同时降低形成在基板表面上的导电层的电阻率,所述颗粒降低导电层的层性能,溅射靶,具有添加了钙的导电层的基板以及形成该层的方法。通过使用直流磁控溅射装置形成在基板的表面上形成层的层的方法包括:通过使用基板支架和靶支架在腔室中布置基板和添加钙的ZAO靶的步骤。直流磁控溅射装置的结构;通过操作连接到腔室的排气管的真空泵,将腔室排气直到腔室的内部压力达到真空度的步骤;将氩气作为溅射气体供应到腔室中,并且将氢气作为反应刺激气体供应到腔室中的步骤;通过向与直流电源的正极连接的基板和与负极连接的添加钙的AZO靶施加电压并进行等离子体放电的步骤,进行溅射。根据添加钙的AZO靶中所含的钙的含量来控制供给至腔室的氢气量。 [附图标记](AA)电阻率(ohm Cm);(BB)比较例;(CC)实例;(DD)H_2的比例

著录项

  • 公开/公告号KR101409543B1

    专利类型

  • 公开/公告日2014-06-19

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20120054565

  • 发明设计人 이상철;안동환;

    申请日2012-05-23

  • 分类号C01F7/02;C01G9/02;C01F11;C04B35/10;

  • 国家 KR

  • 入库时间 2022-08-21 15:40:39

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