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Sintered AZO formation adding Calcium, sputtering target comprised of the formation, substrate with Calcium containing conduction layer, and method for depositing the layer
Sintered AZO formation adding Calcium, sputtering target comprised of the formation, substrate with Calcium containing conduction layer, and method for depositing the layer
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机译:添加钙的烧结AlZO地层,由该地层构成的溅射靶,具有含钙导电层的基板以及该层的沉积方法
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摘要
The present invention relates to a calcium-added sintered AZO capable of improving layer formation speed by preventing the generation of particles degrading the layer properties of a conductive layer while reducing the resistivity value of the conductive layer which is formed on the surface of a substrate, a sputtering target, a substrate with calcium-added conductive layer and a method for forming a layer. The method for forming a layer which forms a layer on the surface of a substrate by using a direct current magnetron sputtering device comprises: a step of arranging the substrate and calcium-added ZAO target in a chamber by using a substrate holder and a target holder of the direct current magnetron sputtering device; a step of exhausting the chamber until the internal pressure of the chamber reaches the degree of a vacuum by operating a vacuum pump connected to the exhaust pipe of the chamber; a step of supplying argon gas as sputtering gas to the chamber and supplying hydrogen gas as reaction stimulation gas to the chamber; and a step of performing sputtering by applying voltage to the substrate connected to the positive electrode of a direct-current power, and the calcium-added AZO target connected to the negative electrode and causing plasma discharge. The hydrogen gas volume supplied to the chamber is controlled according to the content of calcium contained in the calcium-added AZO target. [Reference numerals] (AA) Resistivity (ohm Cm);(BB) Comparative example;(CC) Example;(DD) Partial ratio of H_2
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