首页> 外国专利> Resist Underlayer Film Forming Compositions For Lithography, Containing Aromatic Fused Ring-Containing Resin

Resist Underlayer Film Forming Compositions For Lithography, Containing Aromatic Fused Ring-Containing Resin

机译:光刻胶用抗蚀剂下层成膜组合物,包含芳族稠环树脂

摘要

There is provided a resist underlayer film forming composition for lithography, which in order to prevent a resist pattern from collapsing after development in accordance with the miniaturization of the resist pattern, is applied to multilayer film process by a thin film resist, has a lower dry etching rate than resists and semiconductor substrates, and has a satisfactory etching resistance relative to a substrate to be processed in the processing of the substrate. A resist underlayer film forming composition used in lithography process by a multiplayer film, comprises a polymer containing a unit structure having an aromatic fused ring, a unit structure having a protected carboxyl group or a unit structure having an oxy ring. A method of forming a pattern by use of the resist underlayer film forming composition. A method of manufacturing a semiconductor device by utilizing the method of forming a pattern.
机译:提供一种用于光刻的抗蚀剂下层膜形成用组合物,其为了防止抗蚀剂图样根据抗蚀剂图的小型化而显影后塌陷,通过薄膜抗蚀剂应用于多层膜工艺中,具有较低的干燥度。相对于抗蚀剂和半导体衬底,其蚀刻速率高,并且相对于在该衬底的处理中待处理的衬底具有令人满意的抗蚀刻性。通过多层膜的光刻工艺中使用的形成抗蚀剂下层膜的组合物包括聚合物,该聚合物包含具有芳族稠环的单元结构,具有受保护的羧基的单元结构或具有氧环的单元结构。通过使用抗蚀剂下层膜形成用组合物形成图案的方法。一种利用形成图案的方法制造半导体器件的方法。

著录项

  • 公开/公告号KR101439295B1

    专利类型

  • 公开/公告日2014-09-11

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20097013389

  • 申请日2007-11-27

  • 分类号G03F7/11;C08F212/32;C08F226/12;C08F232/08;

  • 国家 KR

  • 入库时间 2022-08-21 15:40:07

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