An optical connection between the components of electronic modules on the PCB or inside the 3D-MICROSYSTEMS

摘要

A method of optical connection between the electronic module components, consisting in the fact that optical signals corresponding to electrical at different wavelengths are multiplexed, transmitted over optical channel demultiplexing, characterized in that the multiplexer and the optical channel comprises a substrate or a layer of a multilayer printed circuit board, which are made of material transparent to the wavelength range, which employ microlasers diode and, in case frequency changes in the optical channel it com ensiruyut the fact that the detector is set to a certain narrow range of frequencies.