首页> 外国专利> Joining thermally sensitive structures, comprises operatively connecting two functional components by first joining tool which is between mutually associated surface portions of components, and forming compound structure by joining tool

Joining thermally sensitive structures, comprises operatively connecting two functional components by first joining tool which is between mutually associated surface portions of components, and forming compound structure by joining tool

机译:连接热敏结构包括通过第一连接工​​具将两个功能组件可操作地连接在一起,该第一连接工​​具位于组件的相互关联的表面部分之间,并通过连接工具形成复合结构

摘要

Joining thermally sensitive structures, comprises operatively connecting at least two functional components by first joining tool which is introduced between two mutually associated surface portions of functional components, and subsequently forming a compound structure by joining tool. The joining tool is designed as a reactive nano-film.
机译:连接热敏结构的步骤包括:通过首先在功能部件的两个相互关联的表面部分之间引入的连接工具,将至少两个功能部件可操作地连接起来,然后通过连接工具形成复合结构。该连接工具被设计为反应性纳米膜。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号