首页> 外国专利> Method for electrical testing of wafer, involves readjusting relative positions of test contacts and counter contacts of electrical tester to each other depending on result of renewed relative position determination

Method for electrical testing of wafer, involves readjusting relative positions of test contacts and counter contacts of electrical tester to each other depending on result of renewed relative position determination

机译:晶片电测试的方法,包括根据重新确定相对位置的结果重新调整电测试仪的测试触点和反触点的相对位置

摘要

The method involves determining relative positions of test contacts (11) and counter contacts (22) of an electrical tester (1) to each other. The relative positions of the test contacts and the counter contacts are aligned to each other for executing touch contact. Electrical testing of the taking place touch contact is executed for a testing duration. The relative positions are determined again during the testing duration. The relative positions are readjusted depending on result of the renewed relative position determination. An independent claim is also included for an electrical tester comprising test contacts and counter contacts.
机译:该方法包括确定电测试器(1)的测试触点(11)和反向触点(22)彼此之间的相对位置。测试触头和反向触头的相对位置彼此对准以执行触摸接触。对进行中的接触进行电气测试,持续一个测试时间。在测试期间再次确定相对位置。相对位置根据新的相对位置确定的结果被重新调整。对于包括测试触头和反触头的电气测试器,也包括独立权利要求。

著录项

  • 公开/公告号DE102012016435A1

    专利类型

  • 公开/公告日2014-05-28

    原文格式PDF

  • 申请/专利权人 FEINMETALL GMBH;

    申请/专利号DE20121016435

  • 发明设计人 BÖHM GUNTHER;GERS CHRISTOPH;

    申请日2012-08-18

  • 分类号G01R31/28;H01L21/66;

  • 国家 DE

  • 入库时间 2022-08-21 15:37:54

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