首页> 外国专利> A method for joining ceramic bodies by means of an active hard solder, assembly with at least two ceramic bodies, joined together, in particular pressure measurement cell

A method for joining ceramic bodies by means of an active hard solder, assembly with at least two ceramic bodies, joined together, in particular pressure measurement cell

机译:一种通过活性硬焊料连接陶瓷体的方法,该方法包括将至少两个陶瓷体组装在一起,特别是压力测量单元

摘要

An assembly comprises two ceramic body 1, 2 which are connected by means of a joint, which has an active brazing solder 5, wherein the active brazing material, a coherent core volume from the ceramic bodies 1, 2 in each case at least 1 μm, in particular at least 2 μm is spaced apart, whereby the joint has boundary layers on the ceramic body limits, characterized in that the core volume, which is at least 50% of the volume of the joint, free of crystalline phases with a size of more than 6 μm, in particular of more than 4 μm, preferably of more than 2 μm is.
机译:组件包括两个通过接头连接的陶瓷体1、2,该陶瓷体具有活性钎焊焊料5,其中活性钎焊材料与陶瓷体1、2的粘结芯体积分别至少为1μm ,尤其是至少2μm的空间被间隔开,由此接头在陶瓷体边界上具有边界层,其特征在于,芯体积至少为接头体积的50%,没有尺寸大小的结晶相。大于6μm,特别是大于4μm,优选大于2μm。

著录项

  • 公开/公告号DE102012110152A1

    专利类型

  • 公开/公告日2014-05-15

    原文格式PDF

  • 申请/专利权人 ENDRESS + HAUSER GMBH + CO. KG;

    申请/专利号DE201210110152

  • 发明设计人 ELKE SCHMIDT;ANDREAS ROSSBERG;NILS PONATH;

    申请日2012-10-24

  • 分类号C04B37/02;B23K1/008;G01D11/24;G01D11/30;

  • 国家 DE

  • 入库时间 2022-08-21 15:37:50

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