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METHOD FOR JOINING CERAMIC BODIES BY MEANS OF AN ACTIVE HARD SOLDER USING A SOLDER STOP, ASSEMBLY COMPRISING AT LEAST TWO JOINED CERAMIC BODIES, IN PARTICULAR PRESSURE MEASURING CELL
METHOD FOR JOINING CERAMIC BODIES BY MEANS OF AN ACTIVE HARD SOLDER USING A SOLDER STOP, ASSEMBLY COMPRISING AT LEAST TWO JOINED CERAMIC BODIES, IN PARTICULAR PRESSURE MEASURING CELL
An assembly, comprising: a first ceramic body and a second ceramic body connected by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, averaged over a continuous main volume, which includes at least 50% of the volume of the joint, has an average composition CM with a liquidus temperature Tl(CM). An edge region of the joint, which contacts at least one of the ceramic bodies, has an average composition CE with a liquidus temperature Tl(CE), which lies not less than 20 K, preferably not less than 50 K, and especially preferably not less than 100 K above the liquidus temperature Tl(CM) of the average composition CM of the main volume.
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机译:一种组件,包括:第一陶瓷体和第二陶瓷体,通过活性硬焊料或钎焊的接头连接,其中,所述活性硬焊料或钎焊的平均连续连续体积至少为50 %的关节体积具有平均组成CM和液相线温度T1(CM)。与陶瓷体中的至少一个接触的接缝的边缘区域具有平均组成CE,该平均组成CE的液相线温度Tl(CE)不小于20 K,优选地不小于50 K,并且特别优选地不小于在主体积的平均成分CM的液相线温度Tl(CM)之上小于100 K.
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