Carrier e.g. circuit board, for e.g. organic LED of headlight for automobile, has guidance bodies linked with components at front side and exposed with respect to carrier at rear side, where bodies are projected over carrier at rear side

摘要

The carrier (2) has heat guidance bodies (12) i.e. thermal conductors, thermally linked with electrical components e.g. High-power LED (4), at a front side (13v) and exposed with respect to the carrier at a rear side (13r). The guidance bodies are projected over the carrier at the rear side and comprise a part with a non-completely rotationally symmetrical, polygonal cylindrical outer contour. Cooling bodies (14) comprise a recess (16), which is formed at a part of the guidance bodies. The part of one of the guidance bodies comprises a convection cooling structure and a heat pipe.