Micromechanical structure, particularly acceleration sensor, comprises micromechanical functional structure formed on surface of substrate, and strip conductor arrangement with two insulating layers and intermediate strip conductor layer

摘要

The micromechanical structure comprises a substrate (1), particularly monocrystalline silicon substrate with a surface (OS), and a micromechanical functional structure (M) formed in the substrate on the surface. A strip conductor arrangement (LB) is formed above the surface of the substrate. The strip conductor arrangement comprises two insulating layers (10) made of a non- conductive material and an intermediate strip conductor layer (L) made of a conductive material. A cavity (H2) is located between the upper strip conductor layer and the surface of the substrate. An independent claim is included for a method for manufacturing a micromechanical structure.