Method for depositing layer on semiconductor wafer, involves depositing semiconductor wafer on carrier and performing relative movement between semiconductor wafer and carrier for depositing specific layer

摘要

The methods involves depositing semiconductor wafer (5) on a carrier (3). The semiconductor wafer in edge region of rear side portion is set in contact with carrier. The specific layer is deposited on front surface by a vapor deposition. The relative movement between semiconductor wafer and carrier is performed for depositing the specific layer. An independent claim is included for a device for depositing layer on semiconductor wafer.