Oven arrangement for thermal processing of e.g. semiconductor wafer, has closed industrial furnace that is provided with elongate process zone that accommodates workpiece that is processed using process gas passed via discharge opening

摘要

The oven arrangement (10) has closed industrial furnace (14) that is provided with elongate process zone (11) whose outer side is provided with heat resistant element (12). A conveyor (17) is provided for conveying workpiece (W) from feed opening into process zone. Discharge openings (13a,13b) are provided for passing process gas so as to process the workpiece fed into process zone. A pre-heater (16) is arranged at specific end in upstream of industrial furnace along conveying direction. An independent claim is included for a method for thermal processing of semiconductor wafer in oven arrangement.