A method for the production of an optoelectronic component and manufactured in this way optoelectronic component

摘要

The invention relates to a production method, wherein a semiconductor chip (1) without a substrate is provided on an electrically insulating carrier (2). The carrier (2) has electrically conductive contact metallizations (3a, 3b). Furthermore, an electrically conductive carrier substrate (4) and a covering substrate (5) are provided. The covering substrate (5) has electrically conductive contact structures (5a, 5b). The carrier (2) is attached to the carrier substrate (4). Subsequently, the covering substrate (5) is attached to the semiconductor chip (1) and/or to the carrier (2). The electrically conductive contact structures (5a, 5b) are connected in an electrically conductive manner to the electrically conductive contact metallizations (3a, 3b) and the electrically conductive carrier substrate (4). The invention further relates to a semiconductor component produced in such a way.