A method of electrophoretic deposition (EPD) of a film on an exposed conductive surface and an electrical component thereof

摘要

A system, a packaged component and a method for manufacturing a packaged component are disclosed. In one embodiment, a system has a component carrier, a component arranged on the component carrier and an insulation layer which is deposited on an electrically conductive surface by at least one of the component carrier and the component, the insulation layer being a polymer and an inorganic material with a dielectric strength equal to or greater than 15 WS-kV / mm and a thermal conductivity equal to or greater than 15 W / m · K.