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Led module for modified lamps and modified led lamp

机译:用于改装灯的LED模块和改装的LED灯

摘要

A LED module comprises a printed circuit board or a SMD carrier. At least one LED chip is mounted on the board or carrier. A globe top is arranged, i.e. dispensed or mounted, on top of the LED chip and the area of the board or carrier surrounding the LED chip. The surface of the board or carrier, on which the globe top is dispensed, is covered with white reflective material contacting the LED chip, preferably at its side walls.
机译:LED模块包括印刷电路板或SMD载体。至少一个LED芯片安装在板或载体上。在LED芯片的顶部以及围绕LED芯片的板或载体的区域上布置,即分配或安装了球形顶部。在其上分配有球形顶部的板或载体的表面覆盖有白色反射材料,优选地在其侧壁上与LED芯片接触。

著录项

  • 公开/公告号GB2480216B

    专利类型

  • 公开/公告日2014-04-23

    原文格式PDF

  • 申请/专利权人 TRIDONIC JENNERSDORF GMBH;

    申请/专利号GB20110015666

  • 发明设计人 PETER PACHLER;

    申请日2010-02-26

  • 分类号H01L33/60;

  • 国家 GB

  • 入库时间 2022-08-21 15:35:58

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