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Cooling a secondary component by diverting airflow using an air channel associated with a thermal dissipation device that cools a primary component
Cooling a secondary component by diverting airflow using an air channel associated with a thermal dissipation device that cools a primary component
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机译:通过使用与冷却主要部件的散热装置相关联的空气通道转移气流来冷却次要部件
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摘要
Heat is conducted from a primary component to a thermal dissipation structure. An airflow removes heat from the thermal dissipation structure. An air channel associated with the thermal dissipation structure diverts a portion of the airflow to a secondary component, thereby providing cooling to the secondary component.
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