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METHOD FOR PRODUCING SUBSTRATE SHEET FOR CARRIER TAPE, SUBSTRATE SHEET FOR CARRIER TAPE AND CARRIER TAPE

机译:载带胶带基片的生产方法,载带胶带基片和载带胶带

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a substrate sheet for a carrier tape that extremely hardly causes the occurence of fuzz and burr during slitting or during punching in embossing and to provide a substrate sheet for a carrier tape produced by the method and to provide a carrier tape.SOLUTION: The method for producing a substrate sheet for a carrier tape comprises heating and melting a styrene-based resin and extruding the same from a T-die. In the method, a feed block 4 having a plurality of rectangular parallelepiped holes is disposed between an extruder 1 and a T-die 2 and after allowing the styrene-based resin to pass through the rectangular parallelepiped hole, the styrene-based resin is extruded from a T-die to produce a substrate sheet for a carrier tape. The number of rectangular parallelepiped holes provided in the feed block 4 is 5-100, the height thereof is 0.5-4 mm and the ratio of the width to the height is 10 or more. Adjacent rectangular parallelepiped holes are provided so that the width direction thereof is parallel to each other and the width direction of rectangular parallelepiped hole is parallel to the width direction of the T-die 2.
机译:解决的问题:提供一种用于制造载带的基材片的方法,该基材片在切割或压花的打孔期间几乎不引起起毛和毛刺的发生,并且提供一种通过该方法和方法生产的载带的基材片。解决方案:生产用于载带的基材片的方法包括加热和熔融苯乙烯基树脂,并将其从T型模头中挤出。在该方法中,将具有多个长方体孔的进料块4设置在挤出机1和T型模2之间,并且在使苯乙烯类树脂通过长方体孔之后,将苯乙烯类树脂挤出。用T型模制造载带的基材片。设置在进给块4中的长方体孔的数量是5-100,其高度是0.5-4mm,并且宽度与高度的比率是10或更大。设置相邻的长方体孔,使得其宽度方向彼此平行,并且长方体孔的宽度方向与T型模具2的宽度方向平行。

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